Below is a guide addressing the technical specifications and common "hot" fixes for this chip.
| Missing Datasheet Section | Consequence | |---------------------------|-------------| | Thermal resistance (θJA) | Cannot calculate required PCB copper area for heat sinking | | Maximum junction temperature (Tj max) | No safe operating limit | | Output current vs. temperature derating | No guidance on volume/power limits | | Recommended thermal vias or pad layout | PCB designers omit heat dissipation structures | | Internal regulator power dissipation | No way to estimate heat from LDOs inside the chip | cx31993 datasheet fix hot
To fix the "hot" problem, you must identify which plague your dongle suffers from. Below is a guide addressing the technical specifications